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Mold forming epoxy resin APG injection process high temperature curing adhesive

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Mold forming epoxy resin APG injection process high temperature curing adhesive

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Brand Name : wenyou

Model Number : 8316L

Certification : ISO9001, ISO14001, SGS, and UL

Place of Origin : China

MOQ : 20kg/pail as sample

Price : Negotiable

Payment Terms : Normally T/T, L/C

Supply Ability : Plenty of raw material in stock

Delivery Time : 7 -10 work days

Packaging Details : 20kg/pail, 220kg/barrel, 1200kg/tank

Classification : Double Components Adhesives

Usage : sealing and connecting insulation products, current and voltage transformers, etc.

Application : Low-voltage electrical applications, electronics, cable insulation, bonding, sealing, etc.

Appearance of epoxy resin : Light yellow transparent viscous liquid

Viscosity at 25°C : 3000 - 7000mPa.s

Density at 25°C : 1.15 - 1.19g/cm3

Vapor Pressure at 25°C : < 0.01Pa

Flash point : around 110°C

Discription : Mold forming epoxy resin APG injection process high temperature curing adhesive

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Brief Introduction

LE-8316L is a modified BPA-type epoxy resin, combined with LH-8316L, a liquid modified carboxylic anhydride hardener. This system is designed for mold forming and APG injection processes, providing high-temperature curing capabilities.

Applications

This epoxy resin is ideal for low-voltage electrical applications, including electronics, cable insulation, bonding, and sealing. It is particularly suited for sealing and connecting insulation products, as well as current and voltage transformers.

Processing Methods

Processing can be carried out using a conventional gravity casting method under vacuum conditions. The production process can also be tailored to align with the client's existing manufacturing techniques.

Properties

This two-component epoxy resin system consists of LE-8316L and LH-8316L, both in liquid form at room temperature. It is suitable for casting processes, with a glass transition temperature (Tg) ranging between 60-80°C, ensuring durability under elevated temperatures.

Formulation

Epoxy resin LE-8316L 100 pbw
Hardener LH-8316L 100 pbw
Filler Silica powder 300 - 400 pbw
Color paste LC series * Appropriate pbw

Advantage

Mold forming epoxy resin APG injection process high temperature curing adhesive

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Mold forming epoxy resin APG injection process high temperature curing adhesive

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Mold forming epoxy resin APG injection process high temperature curing adhesive

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Mold forming epoxy resin APG injection process high temperature curing adhesive


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